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Thermoplastic Resin compound KM-660
                                                      Series is molding agent as electronic

                                                      parts for

                                                      1. SMPS specialized to
                                                            LED(outdoor) and solar panel

                                                      2. Capacitor for industrial and home use

                                                      6 countries Patent






                                                      1.7$/kg FOB

                                                      Minimum Sales Unit: 1 ton (1 pallet)

                                                      Wrap packing
                                                      1,100 X 1,100 X 120 / 7kg
                                                      1,100mm x 1,100mm x 750mm.
                                                      NET / W 1 T
                                                      GROSS / W 1,007 KG












                                                      ① 40% cheaper than Silicon, 26% cheaper than
                                                           Urethane
                                                      ② In production of SMPS, possible to produce
                                                            250 pieces/hr for 300g molding
                                                      ③ IP 68 or Higher, Thermal conductivity 0.502,
                                                            Softening point 143°C
                                                      ④ No hazardous substances (no Fentin)




            Flame retardant V-0,  Economical cost,  High productivity,  safety (RoHS)





       Economical                                     Water proof, Dust proof, Moisture proof
       but High Quality guaranteed
                                                      No stress to electronic parts

                                                      Quick Molding to Packing, 10 min.

                                                      Compare to Silicon, EMI standard 20-30% lower
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